Convolute high vacuum multi-target magnetron sputtering system

Main applications:

Successively coating single-layed film on flexible belts. It is composed by sputtering chamber, winding system, rectangular magnetron target and its power supply, sample heating and sintering system, pumping system, vacuum monitoring system, gas circuits, and control system.

Specifications:

1. vacuum chambers: composed by belt out chamber, sputtering chamber, and belt in chamber, all sized about Ø400 × 300

2. ultimate vacuum: 2 × 10^-5Pa

3. single target sputtering: target is above the belt; target to belt distance is manually adjustable between 30 - 80 mm. RF power is 1000W.

4. substrate: flexible engineering plastic belt, 150mm width and 0.05mm thickness; motor controlled, sample movement speed 1 - 10 mm/Min successively adjustable; the belt temperature range from RT to 200°C, sintering temperature 200°C.

5. mass flowmeter controlled gas circuits; alarm system for water cooling.