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Ultrahigh vacuum 3-target magnetron sputtering system

Ultrahigh vacuum 3-target magnetron sputtering system Ultrahigh vacuum 3-target magnetron sputtering system

Designed for deposition of metal films, dielectrical films, and other laboratory research on new materials.

Specifications

1. Ultimate vacuum: 3 × 10-5Pa

2. Vacuum chamber: Ø 400 × 300, with sample holder installed at the upper cover; the sample holder is sized Ø20, and can go up and down under manual or motor drive, and is rotatable at 10 - 60 rpm. The sample temperature is from RT to 500°C, program - controlled; the target is sized Ø40, which can be manually adjusted relative to the sample within 40mm motion distance.

3. Power supply: two sets of 500W DC power supply and a 500W RF power supply.

4. Japanese mass flowmeter is equipped for precision gas inlet control. American water flow meter is equipped to control the cooling water of the target, preventing the target damage from insufficient cooling water.

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