Ultrahigh vacuum 4-target magnetron sputtering system

Main applications:

Deposition of semiconductor film, dielectrical films, and metal films for production or research purposes.

Specifications:

1. ultimate vacuum: 6.6 × 10^-5Pa
2. sputtering chambers: vertical stand ∩ - like structure, double - layered for water cooling, dimension Ø 600 × 600
3. four rectangular targets: dimension 430 × 130
4. motorized sample revolution and rotatory at adjustable speed; highest sample temperature 300°C
5. each target is separately controlled, which can work independently
6. both AC and RF sputtering can be realized at 5KW maximum power